round type led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts LDGM2041 doc. no : qw0905-LDGM2041 rev. : a date : 23 - feb. - 2008 data sheet
ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation package dimensions part no. LDGM2041 page1/5 25% 50% 75% 100% -60 -30 50%75% 0 25%100% 0 30 60 25.0min 0.5 typ 1.0min 2.54typ 1.5max 5.2 4.2 4.0 3.0
-30 ~ +100 tstg storage temperature 2700620030 4.0 3.5 36 525 LDGM2041 ingan/gan note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. spectral halfwidth nm typical electrical & optical characteristics (ta=25 ) part no dominant color green emitted material lens wave length nm d viewing angle 2 1/2 (deg) forward voltage @20ma(v) luminous intensity @20ma(mcd) max. typ. min. typ. ratings dgm 30 100 50 120 -20 ~ +80 150 i fp peak forward current duty 1/10@10khz operating temperature electrostatic discharge(*) reverse current @5v power dissipation t opr esd pd ir forward current absolute maximum ratings at ta=25 symbol parameter i f ma v a mw unit ma ligitek electronics co.,ltd. property of ligitek only page2/5 wave length nm p peak 518 LDGM2041 part no. green transparent * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/5 page LDGM2041 part no.
temp( c) 25 0 0 120 260 2 /sec max preheat 50 5 /sec max 100 260 c3sec max 150 time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile page 4/5 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max LDGM2041 part no.
the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. solderability test solder resistance test thermal shock test high temperature high humidity test low temperature storage test mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. reliability test: high temperature storage test operating life test test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reference standard page 5/5 LDGM2041 part no.
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